China Develops Prototype EUV Lithography Machine
Chinese engineers activated a working prototype of an Extreme Ultraviolet (EUV) lithography machine in Shenzhen on July 1, 2026, successfully exposing silicon wafers with patterns at the 5-7 nanometer scale. As of July 1, 2026, this milestone demonstrates that fundamental physics and engineering challenges have been overcome, though yields are not yet commercially viable. This development is a significant leap in China's decade-long effort to develop domestic chip manufacturing capabilities, occurring amidst U.S. export restrictions and allegations of ASML EUV machine violations, which ASML denies. Huawei is reportedly playing a central coordinating role in this effort, with commercial-scale production not expected until the late 2030s.
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July 2026 — 1 developments
China Activates Working EUV Lithography Prototype in Shenzhen
Chinese engineers have activated a working prototype of an Extreme Ultraviolet (EUV) lithography machine in Shenzhen, successfully exposing silicon wafers with patterns at the 5-7 nanometer scale. This milestone demonstrates that fundamental physics and engineering challenges have been overcome, though yields are not yet commercially viable. The development is a significant leap in the nation's decade-long effort to develop domestic chip manufacturing capabilities.
June 2026 — 6 developments
China Completes, Tests EUV Lithography Machine Prototype; Commercial Production Years Away
China has reportedly completed and is testing a prototype EUV lithography machine, though commercial-scale production is not expected until the late 2030s. Concurrently, SMIC is testing its first domestically built DUV immersion lithography machine for the 28nm node, seen as a stepping stone towards EUV development. These efforts occur amidst US export restrictions and allegations of ASML EUV machine violations, which ASML denies.
US Commerce Secretary Warns ASML Over Suspected EUV Machine Transfer to China
U.S. Commerce Secretary Howard Lutnick has expressed concerns to ASML about a potential transfer of an advanced EUV machine to China. The U.S. government claims to possess evidence of EUV-related components and specialized transport equipment being shipped to China, though ASML denies any such sales.
US Alerts ASML to Potential Restricted EUV Machine in China Amid Domestic Development
The United States alerted ASML on June 18, 2026, that a restricted EUV machine may have reached China, potentially violating export controls. This alert comes as China continues its domestic EUV lithography development, including Huawei's testing of machine elements and a prototype EUV machine developed in Shenzhen.
China Advances in Semiconductor Equipment Sector, Entering Panel-Level Packaging Race
As of June 17, 2026, Chinese manufacturers are reportedly entering the global race for Panel-Level Packaging (PLP) dominance, signaling broader progress in China's semiconductor equipment sector. This development occurs alongside China's ongoing efforts to develop its own EUV lithography capabilities, with a prototype reportedly in testing phases.
China's Semiconductor Sector Sees Growth as Manufacturers Enter Global Top 20
Three Chinese semiconductor equipment manufacturers have entered the global top 20 by sales in 2025, marking significant growth in the domestic sector. This development occurs as China accelerates its efforts to develop its own EUV lithography tools and aims to localize 70% of equipment for mature process technologies by 2027. This push is a response to US sanctions and aims for technological self-sufficiency.
China's EUV Lithography Prototypes Undergoing Testing at Huawei Facility
China's domestically developed EUV lithography system prototypes are undergoing testing at Huawei's Dongguan facility, assembled using components from older ASML systems. While initial reports suggested trial production in Q3 2025 and mass production in 2026, more recent analyses indicate mass production may begin in 2026, with functional chips from a prototype potentially produced by 2028, and 2030 being a more realistic timeline for high-volume manufacturing.
May 2026 — 3 developments
China's EUV Lithography Ambitions Face Skepticism Amidst New Chip Manufacturing Method Announcement
Experts express doubt regarding China's capacity to develop a mass-production EUV system within the current decade, despite reports of a prototype machine. Huawei has announced a new manufacturing method for 1.4nm chips by 2031, bypassing EUV reliance, highlighting industry challenges.
China Operates EUV Lithography Prototype with LDP Technology, Targets Production Goals
China has operated a functional prototype EUV lithography machine using Laser-Induced Discharge Plasma (LDP) technology, achieving a stable 13.5nm EUV beam with 3.42% conversion efficiency. Engineers are targeting 250W for a production-ready model, with trial production reportedly set for Q3 2025, though experts remain skeptical about high-volume manufacturing within the next decade.
Huawei Coordinates China's EUV Lithography Development with SMEE Involvement
Huawei is reportedly playing a central coordinating role in China's development of domestic EUV lithography machines, with Shanghai Micro Electronics Equipment (SMEE) also being a significant player. SMEE has filed patents related to EUV radiation generators and lithography equipment. This effort is part of China's push for technological self-reliance in semiconductors, intensified by U.S. export controls.
April 2026 — 1 developments
China Aims for Domestic EUV Chip Production by 2028, Explores LDP for Semiconductor Independence
China aims to achieve chip production using its domestically developed EUV lithography technology by 2028, with 2030 considered a more realistic target. Researchers are exploring alternative EUV light generation methods like laser-induced discharge plasma (LDP) to overcome challenges and achieve semiconductor independence amidst U.S. sanctions.
March 2026 — 1 developments
China tests prototype EUV lithography machine in Shenzhen
A Chinese EUV lithography machine prototype is reportedly undergoing extensive testing in a high-security facility in Shenzhen. This prototype, capable of generating 13.5nm EUV light, represents a monumental technological achievement for China, demonstrating its ability to build a functional EUV system. However, it has not yet produced commercially viable chips, and significant challenges remain in areas such as optical systems, throughput, and overall yield, with ongoing efforts focused on refinement and optimization.
December 2025 — 1 developments
Chinese Officials Hint at Significant Progress in Domestic Lithography Technology
Public statements from Chinese officials or state media begin to hint at significant progress in domestic lithography technology, without revealing specific details about the EUV prototype. These statements often emphasize China's growing self-reliance in critical technologies and its commitment to overcoming foreign restrictions. Such announcements aim to bolster national confidence and signal advancements to the international community.
September 2025 — 1 developments
Prototype Etches Basic Patterns at Advanced Node Resolutions
Reports indicate that the prototype successfully etched basic patterns at resolutions approaching advanced nodes, though not yet at commercial yield or speed. This suggests the machine is capable of producing features relevant to modern chip manufacturing, albeit with limitations. The focus remains on improving performance, stability, and throughput to meet industry standards.
June 2025 — 1 developments
Prototype conducts initial patterning experiments, demonstrating basic resolution capabilities on test wafers
Initial patterning experiments are conducted using the prototype, focusing on demonstrating basic resolution capabilities on test wafers. These early tests aim to verify the machine's ability to transfer patterns at EUV wavelengths, even if at low throughput or with imperfections. This phase provides critical data for further optimization and refinement of the system.
January 2025 — 1 developments
Engineers begin power-on and calibration tests for newly assembled EUV prototype
Initial power-on and calibration tests commence for the newly assembled EUV prototype. Engineers begin verifying the functionality of all integrated systems, including the light source, optical train, wafer handling, and vacuum systems. This phase focuses on ensuring all components operate as designed and are properly synchronized, laying the groundwork for actual patterning experiments.
December 2024 — 1 developments
Shenzhen facility completes assembly of first full-scale EUV lithography machine prototype
The physical assembly of the first full-scale EUV lithography machine prototype is completed at the high-security facility in Shenzhen. This marks a significant engineering achievement, bringing together years of research and component development into a single, integrated system. The completion of assembly paves the way for comprehensive system-level testing and calibration.
October 2024 — 1 developments
Integrated Testbed Generates and Manipulates 13.5nm EUV Light
Initial reports indicate the successful generation and manipulation of 13.5nm EUV light within a controlled environment using the integrated testbed. This milestone confirms the operational feasibility of the domestically developed light source and the ability to guide the EUV beam through a rudimentary optical path. It represents a critical proof-of-concept for the core EUV technology.
July 2024 — 1 developments
Sub-systems successfully integrated into preliminary testbed for functional verification.
Various independently developed sub-systems, including the light source, optical modules, wafer stage, and vacuum systems, are successfully integrated into a preliminary testbed. This integration phase allows for initial functional verification of how these complex components interact. This step is crucial for identifying and resolving compatibility issues before final assembly of the full prototype.
June 2024 — 1 developments
Huawei Tests 1.4nm Chip, Targets 2026 Mass Production with Proprietary EUV Technology
Huawei has announced testing a new 1.4nm chip utilizing its proprietary EUV technology, developed with the Harbin Institute of Technology. The domestically produced EUV machine reportedly achieves high energy conversion efficiency and is targeted for mass production in 2026 with a 70% yield.
May 2024 — 1 developments
China activates prototype EUV lithography machine in Shenzhen, targets chip production by 2028
Sources indicate that a prototype EUV lithography machine has been activated in Shenzhen, China. This development, reportedly based on reverse-engineering ASML scanners, marks a significant step in China's semiconductor ambitions. The machine is on track to produce prototype chips by 2028, though some analysts suggest 2030 might be more realistic.
April 2024 — 1 developments
Vacuum and contamination control systems advance for EUV machines
Further advancements are reported in vacuum technology and contamination control systems, which are essential for the operational environment of an EUV machine. The extreme ultraviolet light is absorbed by air, necessitating a near-perfect vacuum, while even microscopic contaminants can severely impact performance. These developments ensure the integrity of the EUV light path and the cleanliness required for high-yield manufacturing.
January 2024 — 2 developments
Harbin Institute of Technology and Shanghai Institute collaborate to enhance EUV light focusing
Building on the LDP light source breakthrough, the Harbin Institute of Technology collaborates with the Shanghai Institute of Optics and Fine Mechanics to enhance EUV light focusing and control. This partnership aims to refine the precision and stability of the EUV beam, which is critical for accurate patterning on wafers. Other institutions, including Tsinghua University, also contribute to related technologies, such as power optimization and future light source designs, showcasing a coordinated national effort.
Harbin Institute of Technology develops compact EUV light source using LDP technology
The Harbin Institute of Technology, under Professor Zhao Yongpeng, achieves a significant breakthrough by developing a compact and efficient EUV light source using Laser-Induced Discharge Plasma (LDP) technology. This innovative approach offers a potentially simpler, more cost-effective, and energy-efficient alternative to the Laser-Produced Plasma (LPP) method used by ASML. This development is a crucial step in addressing one of the core components of an EUV machine.
December 2023 — 1 developments
Shenzhen Establishes High-Security Facility for EUV Lithography Machine Prototype Assembly
Information surfaces about the establishment of a dedicated, high-security facility in Shenzhen, specifically designed for the final assembly and testing of an EUV lithography machine prototype. This facility is equipped with advanced cleanroom technology and specialized infrastructure, indicating that the project has moved beyond component development to system integration. The creation of such a facility highlights the advanced stage of the project.
September 2023 — 1 developments
Chinese Consortium Successfully Tests High-Precision Wafer Stage Prototype
Reports emerge of successful testing of a prototype high-precision wafer stage by a Chinese research consortium. The wafer stage is responsible for accurately positioning the silicon wafer during the lithography process, requiring nanometer-level precision. This development is crucial for achieving the alignment and overlay accuracy necessary for advanced chip manufacturing.
June 2023 — 1 developments
Chinese Researchers Announce Breakthroughs in EUV Photoresist Materials
Chinese researchers announce breakthroughs in developing advanced photoresist materials specifically designed for EUV wavelengths. Photoresists are critical for transferring patterns onto silicon wafers with high precision. Overcoming challenges in EUV photoresist development is a significant step, as these materials must be highly sensitive and capable of resolving extremely fine features under EUV exposure.
March 2023 — 1 developments
SMEE Files Patent for Extreme Ultraviolet (EUV) Radiation Generators and Lithography Equipment
SMEE files a significant patent application for 'extreme ultraviolet (EUV) radiation generators and lithography equipment,' signaling concrete progress in its research and development efforts. This patent filing indicates that SMEE is actively working on core EUV technologies, including the light source and the overall system architecture. While a patent does not guarantee a working product, it demonstrates a strategic focus and intellectual property development in the EUV domain.
December 2022 — 1 developments
US Commerce Department adds Shanghai Micro Electronics Equipment to Entity List
Shanghai Micro Electronics Equipment (SMEE) is added to the US Commerce Department's Entity List, effectively blacklisting the company and restricting its access to certain US technologies. This sanction further intensifies China's urgency to develop fully indigenous lithography solutions, as it directly impacts a key domestic player in the semiconductor equipment sector. The move underscores the geopolitical tensions surrounding advanced chip technology.
June 2022 — 1 developments
Chinese Research Institutions Develop High-NA Optical System Prototypes for Chip Manufacturing
Chinese research institutions, including those affiliated with CAS, reportedly make strides in developing high-numerical aperture (NA) optical systems prototypes. High-NA optics are essential for achieving the fine resolution required for advanced chip manufacturing with EUV. These developments indicate a focused effort on mastering the complex optical challenges inherent in EUV lithography.
January 2022 — 1 developments
SMEE reports significant progress in DUV immersion lithography technology
Shanghai Micro Electronics Equipment (SMEE) reports significant progress in its deep ultraviolet (DUV) immersion lithography technology, with some sources suggesting it is nearing production readiness for 28nm nodes. While not EUV, this achievement demonstrates SMEE's growing expertise in precision lithography and its ability to manufacture complex semiconductor equipment. This experience provides a crucial foundation for its more ambitious EUV development efforts.
July 2021 — 1 developments
China prioritizes domestic supply chains for semiconductor manufacturing equipment
The Chinese government issues new directives emphasizing the prioritization of domestic supply chains for semiconductor manufacturing equipment. These policies encourage deeper collaboration between national research institutions and domestic equipment manufacturers, such as SMEE, to foster indigenous production capabilities. The aim is to reduce reliance on foreign suppliers and build a resilient, self-sufficient semiconductor ecosystem.
January 2021 — 1 developments
State-backed research institutes achieve breakthroughs in critical EUV components
State-backed research institutes reportedly achieve initial breakthroughs in critical EUV components, including the development of high-reflectivity multi-layer mirrors and advanced vacuum systems. These components are fundamental to guiding and maintaining the purity of the EUV light path, demonstrating early success in overcoming some of the most challenging technical hurdles. These developments are crucial steps towards a fully functional EUV machine.
September 2020 — 1 developments
China launches recruitment programs to attract overseas Chinese scientists for EUV lithography.
China intensifies its global talent acquisition efforts, launching highly attractive recruitment programs targeting overseas Chinese scientists and engineers. These initiatives offer substantial financial incentives, research funding, and prestigious positions to experts in fields critical to EUV lithography, such as optical engineering, materials science, and vacuum technology. The goal is to repatriate top talent and accelerate domestic innovation.
March 2020 — 1 developments
Chinese Institutions Establish Consortia for EUV Sub-component Research
Major research consortia are established, bringing together leading institutions like the Chinese Academy of Sciences (CAS), Tsinghua University, and Peking University. These collaborations focus on fundamental research and development of key EUV sub-components, including advanced optics, light sources, and precision mechanics. This structured approach aims to pool national expertise and resources to tackle the complex challenges of EUV technology.
June 2019 — 1 developments
China's Big Fund Phase II launches with $29 billion for semiconductor development
China's National Semiconductor Industry Investment Fund (Big Fund) Phase II is officially launched, committing over $29 billion to bolster domestic semiconductor capabilities. A significant portion of these funds is earmarked for critical equipment development, including advanced lithography, signaling a strong state-backed financial commitment to the 'Manhattan Project.' This investment aims to reduce reliance on foreign technology and accelerate indigenous innovation across the supply chain.
January 2019 — 1 developments
US pressure campaign blocks ASML from selling EUV technology to China, intensifying China's domestic lithography efforts
The United States initiated a pressure campaign to prevent China from acquiring advanced EUV technology, leading to ASML being barred from selling its cutting-edge EUV equipment to China. This move significantly intensified China's resolve to develop its own domestic lithography capabilities, marking a pivotal moment for the country's semiconductor ambitions. Concurrently, China launched an aggressive talent acquisition campaign, offering substantial incentives to attract overseas experts in lithography and related fields, including former ASML engineers.